Method and apparatus for producing three-dimensional decoration piece made of thermoplastic synthetic resin

ABSTRACT

A method and an apparatus for producing a three-dimensional decoration piece that does not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method includes putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table, emitting a high frequency wave for dielectric heating; stopping the high frequency dielectric heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold; and lowering said upper mold onto the second table. In the apparatus, the second table or the lower mold is provided on the top surface thereof with recessed sections that are transversally and inwardly separated from a position where an edge of the first machining means contacts, by 0.2 mm to 1 mm; and a cushion member being arranged in the respective recessed sections.

This is a divisional of application Ser. No. 13/698,815 filed Nov. 19,2012, which is a National Stage Application of PTC/JP2010/059377 filedJun. 2, 2010, The entire disclosures of the prior applications arehereby incorporated by references in their entirety.

TECHNICAL FIELD

This invention relates to a method and an apparatus for producing athree-dimensional decoration piece of thermoplastic synthetic resin thatis to be fitted to, an automobile, a bicycle, a motor boat, an officeautomation apparatus, a home electric appliance, a sporting tool, amachine or the like, by means of a tacky adhesive agent or a bondingagent.

BACKGROUND ART

Various methods employing a metal mold and high frequency dielectricheating have been proposed as methods for producing a three-dimensionaldecoration piece of synthetic resin to be used as emblem or the like(see, inter alia, Patent Documents Nos. 1, 2 and 3 listed below).

However, with the invention disclosed in Patent Document No. 1, thethree-dimensional decoration piece is produced by using an indented moldand a protruding mold, and the piece is produced between the indentedmold and the protruding mold. Thus, a rear surface of the produced pieceis not flat but recessed. Therefore, an area to be bonded or tackilybonded to an object to be decorated is rather small, and hence does notprovide satisfactory bonding (tacky bonding) strength.

With the invention disclosed in Patent Document No. 2, when athree-dimensional pattern on an upper surface of a polyurethane film isformed by an engraving die, the engraving die heats and presses thethree-dimensional decoration piece entirely, so as to damage the tackyadhesive effect of the adhesive layer formed on the rear surface of thedecoration piece.

The invention disclosed in Patent Document No. 3 provides a flatadhesive layer on the rear surface of the decoration piece to beproduced. However, it has been found that the original tacky adhesiveforce is degraded under pressure, to reduce the tacky adhesion strengthrelative to the object to which the decoration piece is fitted almost byhalf.

A number of experiments have proved that a tacky adhesive material and atacky adhesive agents are degraded by heat, and a tacky adhesionstrength is further reduced when pressure is applied thereto.

LIST OF PRIOR ART DOCUMENTS Patent Documents

Patent Document No. 1: JP-B-H07-102620

Patent Document No. 2: JP-B-3235943

Patent Document No. 3: JP-B-4227587

SUMMARY OF THE INVENTION Problem to Be Solved by the Invention

Therefore, the object of the present invention is to provide a methodand an apparatus for producing a three-dimensional decoration piece thatdo not damage the tacky bonding or adhesion strength of the lower layermaterial of the decoration piece.

Means for Solving the Problem

In the first aspect of the present invention, there is provided a methodfor producing a three-dimensional decoration piece of thermoplasticsynthetic resin comprising:

putting an upper layer material on a first table operating as cathode;

lowering an upper mold operating as anode onto the first table to pressthe upper layer material, emitting a high frequency wave for dielectricheating, to form a three-dimensionally formed body from the upper layermaterial by molding and fusion-cutting and temporarily holding thethree-dimensionally formed body to the upper mold;

stopping the high frequency dielectric heating;

moving a second table carrying a lower layer material having a tackybonding property to below the upper mold temporarily holding thethree-dimensionally formed body; and

lowering said upper mold onto the second table to press thethree-dimensionally foamed body, cutting the lower layer material andtacky bonding the three-dimensionally formed body and the lower layermaterial (Embodiment 1).

Preferably, an intermediate layer material is put on said first table;

said upper layer material is put on the intermediate layer material; and

said upper mold is lowered onto the first table to press said upperlayer material and said intermediate layer material and emitting a highfrequency wave for dielectric heating, to form the three-dimensionallyfanned body by fusion bonding said upper layer material and saidintermediate layer material (Embodiment 2).

Preferably, the lower layer material having a releasing paper arrangedto a rear surface thereof is put on said second table (Embodiment 3).

Preferably, after the cut the lower layer material, unnecessary partsthereof are removed, and an application film is adhered onto the topsurface of the upper layer (Embodiment 4).

Preferably, a cushion member is arranged under the lower layer materialin regions located outside areas where the lower layer material is cut,to absorb the pressure of the upper mold by the cushion member(Embodiment 5).

In a second aspect of the present invention, there is provided anapparatus for producing a three-dimensional decoration piece ofthermoplastic synthetic resin, comprising:

an upper mold operating as anode, a first table operating as cathode anda second table,

said upper mold having a first machining means;

the first machining means fusion-cutting a material at the time of highfrequency dielectric heating between the upper mold and the first table;

said first machining means cutting the material at the time of pressingbetween the upper mold and the second table;

said upper mold being provided on a bottom surface thereof with atemporary holding means;

said second table having a flat top surface;

said second table being provided on the top surface thereof withrecessed sections, each of which being transversally and inwardlyseparated from a position where an edge of the first machining meanscontacts, by 0.2 mm to 1 mm;

a cushion member being arranged in the respective recessed sections(Embodiment 6).

There is also provided an apparatus for producing a three-dimensionaldecoration piece of thermoplastic synthetic resin, comprising:

an upper mold operating as anode, a first table operating as cathode, asecond table, and a lower mold arranged on the second table;

said upper mold having a first machining means;

the first machining means fusion-cutting a material at the time of highfrequency dielectric heating between the upper mold and the first table;

the first machining means cutting the material at the time of pressingbetween the the upper mold and the second table;

said upper mold being provided on a bottom surface thereof with atemporary holding means;

said lower mold having a flat top surface;

said lower mold being provided on the top surface thereof with recessedsections, each of which being transversally and inwardly separated froma position where an edge of the first machining means contacts, by 0.2mm to 1 mm;

a cushion member being arranged in the respective recessed sections(Embodiment 7).

ADVANTAGES OF THE INVENTION

According to the inventions as defined in Embodiments 1 through 3 and 5through 7, the lower layer material having a tacky bonding property isnot subjected to any high frequency dielectric heating, and hence it isnot heated. Therefore, the tacky bonding property of the lower layermaterial is prevented from being degraded.

According to the invention as defined in Embodiment 5, since the cushionmember is arranged under the lower layer material, the tacky bondingproperty of the lower layer material is prevented from being degradedunder pressure, so as to further prevent the tacky bonding property frombeing degraded effectively.

Since the cushion member is not arranged below the lower layer materialat a portion where the lower layer material is cut, the lower layermaterial can be easily cut.

According to the invention as defined in Embodiment 6, since the cushionmember is arranged at the above defined position on the top surface ofthe second table, the tacky bonding property of the lower layer materialis prevented from being degraded under pressure. Additionally, since nocushion member is arranged under the cutting positions of the lowerlayer material, the lower layer material can be easily cut.

The invention as defined in Embodiment 7 provides an additionaladvantage that only the lower mold needs to be prepared separately whenthe pattern of the three-dimensional decoration piece is changed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic bottom view of an upper mold 21.

FIG. 2 is a schematic sectional view taken along line M-M in FIG. 1 thatschematically illustrates a state before the high frequency dielectricheating of the first step.

FIG. 3 is a schematic sectional view taken along line M-M in FIG. 1 thatschematically illustrates a state during the high frequency dielectricheating of the first step.

FIG. 4 is an enlarged schematic sectional view of part N in FIG. 3.

FIG. 5 is a schematic sectional view taken along line M-M in FIG. 1 thatschematically illustrates a state after the high frequency dielectricheating of the first step.

FIG. 6 is a schematic plan view of a lower mold 42.

FIG. 7 is a schematic sectional view taken along line P-P of the lowermold 42 in FIG. 6.

FIG. 8 is a schematic illustration of a state before pressing of thesecond step, specifically cross sectional views taken along line P-P ofthe lower mold 42 and corresponding respective sectional views of theupper mold, a three-dimensionally formed body and a lower layermaterial.

FIG. 9 is a schematic illustration of a state during the pressing of thesecond step, specifically a sectional view taken along line P-P of thelower mold 42 and corresponding respective sectional views of the uppermold, the three-dimensionally formed body and the lower layer material.

FIG. 10 is an enlarged selective of part X in FIG. 9 from which thethree-dimensionally formed body and the lower layer material are notshown,

FIG. 11 is a schematic illustration of a state after the pressing of thesecond step, specifically a sectional view taken along line P-P of thelower mold 42 and corresponding respective cross sectional views of theupper mold, the three-dimensionally formed body and the lower layermaterial.

FIG. 12 is a schematic plan view of a three-dimensional decoration pieceproduced by a method according to the present invention.

FIG. 13 is a schematic sectional view taken along line Y-Y in FIG. 12.

PREFERRED EMBODIMENT OF THE INVENTION Three-Dimensional Decoration Piece

Firstly, a three-dimensional decoration piece which is produced by amethod and an apparatus according to the present invention will bedescribed.

FIG. 12 is a schematic elevation of a three-dimensional decoration pieceproduced by a method and an apparatus according to the presentinvention. FIG. 13 is a schematic cross sectional view taken along lineY-Y in FIG. 12.

As shown in FIG. 13, the three-dimensional decoration piece comprises anupper layer 11 molded to show a three-dimensional shape, a lower layer13 arranged under the upper layer 11 and having a tackily bondingfunction, an application film 15 arranged on a top surface of the upperlayer 11 and a releasing paper 16 arranged under a bottom surface of thelower layer 13.

Since the lower layer 13 has an tackily bonding property, the releasingpaper 16 is arranged under the lower layer 13, as will be describedlater.

The application film 15 may be a transparent resin film or a sheet ofpaper, a rear surface (bottom surface) of which a tackily bondingmaterial is arranged. The three-dimensional decoration piece isprotected by the applied application film. In addition, even ifcomponents (in the illustrated example, characters or symbols of N, E,O, - and X) are separated from one another, the relative positions ofthe components can be maintained.

A three-dimensional decoration piece produced by a method and anapparatus according to the present invention can be applied to any ofvarious articles including automobiles, motor bicycles, motorboats,bicycles, office automation apparatus, electric home appliances,sporting tools and machines in order to decorate it.

<Upper Layer>

The upper layer 11 of a three-dimensional decoration piece is providedwith a three-dimensional shape. The surface of the upper layer may befurther decorated by, such as printing. The upper layer 11 is formed bya surface layer material 11 and an intermediate layer material 12 a. Aswill be described later, the surface layer material 11 a and theintermediate layer material 12 a are fusion-bonded each other in theprocess of producing the three-dimensional decoration piece. In theillustrated example as explained below, the upper layer materialcomprises a surface layer material 11 a and an intermediate layermaterial 12 a. However, the intermediate layer material 12 a is notessential, if a cavity of an upper mold 21 is filled with the surfacelayer material 11 a (and hence the surface layer material 11 a alone canprovide the thickness of the three-dimensional decoration piece)

<Surface Layer Material>

The surface layer material 11 a is a material to be used to make thesurface of the three-dimensional decoration piece aestheticallyappealing, and thermoplastic synthetic resin can be used for it. Any ofknown thermoplastic synthetic resin materials can be used for athree-dimensional decoration piece according to the present invention.Examples of known thermoplastic synthetic resin materials that can beused for the surface layer material include polyvinylchloride film,polyurethane film, polyester film and polyolefin film. The thermoplasticsynthetic resin film to be used for the purpose of the present inventionmay be a laminate film.

Metal may be deposited on the thermoplastic synthetic resin film byevaporation by means of a known technique to provide an appearance likea metal-made three-dimensional decoration piece. Examples of metaldeposited films that can be used for the purpose of the presentinvention include metal deposited polyvinylchloride film, metaldeposited polyurethane film, metal deposited polyester film and metaldeposited polyolefin film. Any known metal can be used for the purposeof the present invention, for example, aluminum, chromium, silver andtin.

The surface layer material 11 a is appropriately selected depending onthe three-dimensional decoration piece to be produced. The surface layermaterial may be further decorated by printing of a known technique.

<Intermediate Layer Material>

The intermediate layer material 12 a is a layer for providing thethree-dimensional decoration piece with a certain thickness and forpreventing one or more than one voids from being formed in thedecoration piece. Thermoplastic synthetic resin can be used for theintermediate layer material, for example, polyvinylchloride sheets,polyurethane sheets and polyolefin sheets etc. <Lower Layer and LowerLayer Material>

The lower layer 13 is a layer for fitting the upper layer 11 onto anobject to be decorated such as a car, and hence has an adhesive functionor a tackily bond function. The lower layer is made of a lower layermaterial 13 a.

The lower layer material 13 a is a material having an adhesive functionor a tackily bond function. Any known materials that can be used forfitting a three-dimensional decoration piece to the object to bedecorated can be used for the purpose of the invention, for example,double sided tapes having a base member and double sided tapes having nobase member, although the invention is not limited to these materials.The lower layer material 13 a is selected in view of the decorationpiece and the object to be decorated.

<Apparatus for Producing Decoration Piece>

According to the present invention, a three-dimensional decoration piece1 is produced by

(1) high frequency dielectric heating the above described materials bymeans of a first table 31 and an upper mold 21, to produce athree-dimensionally formed body 14 b (1st Step); and

(2) pressing the three-dimensionally formed body 14 b by means of asecond table 41 and the upper mold 21 (2nd Step) to cut the lower layermaterial 13 a, so as to Bonn the three-dimensional decoration piece 1.

Now, the apparatus used in the present invention will be describedbelow.

The apparatus according to the present invention comprises an upper mold21 to be used in the first step and the second step, a first table 31 tobe used in the first step, and a second table 41 to be used in thesecond step.

In the first step, the upper mold 21 functions as anode, while the firsttable 31 functions as cathode. In the second step, on the other hand,the upper mold 21 does not function as anode.

Although not shown, the first table 31 and the second table 41 may bemade movable so as to be alternately placed below the upper mold 21(table sliding method). Alternatively, a turn table may be used to makethe first table 31 and the second table 41 movable. Any known method formoving the first table 31 and the second table 41 can be used for thepurpose of the present invention.

The upper mold 21 is provided with cavities for defining a surfaceprofile of the three-dimensional decoration piece. Cross sectional viewsof the cavities are not limited to the illustrated examples, and mayshow the shape of an inverted V, a semi-circle, a trapezoid or any othershape.

The upper mold 21 is provided with a first machining means 22 and asecond machining means 23.

The first machining means 22 functions as a fusion-cutting blade in thefirst step so as to fusion-cut the surface layer material 11 a and theintermediate layer material 12 a, and functions as a cutting blade inthe second step of applying pressure without high frequency dielectricheating, so as to simply cut the lower layer.

The second machining means 23 functions as a pressing blade in the firststep. The second machining means 23 is arranged when necessary. In otherwords, it is not essential. While some of the dimensions of the firstmachining means 22 and other members are shown in FIG. 4, the presentinvention is not limited to the dimensional values shown in FIG. 4.

As shown in FIG. 1, the upper mold 21 is provided on a lower surfacethereof with a temporary holding means 25. The temporary holding means25 temporarily holds the three-dimensionally formed body 14 b producedin the first step to the upper mold 21. The temporary holding means 25may be, for example, an tackily bonding tape.

The upper mold 21 is provided with an aligning hole 24. A pin (notshown) are driven into the respective aligning holes 24 and thecorresponding aligning holes 45 of the second table 41, which will bedescribed hereinafter, in order to align the upper mold 21 and thesecond table 41.

The first table is operated as cathode in the first step, but it is notoperated as such in the second step. A top surface of the first table is31 a flat surface.

The upper mold 21 and the first table 31 operate for high frequencydielectric heating. Any known ones can be used for the purpose of thepresent invention.

The second table 41 is not used in the first step. In other words, it isused only in the second step. A top surface of the second table 41 isflat. The second table 41 is provided on the surface thereof with arecessed section.

Alternatively, as shown in the illustrated example, a lower mold 42 maybe placed on the second table 41. The lower mold 42 has a flat topsurface and a recessed section 43 on the top surface. This arrangementis convenient for instances where the current design ofthree-dimensional decoration piece is replaced by some other design,because only the lower mold needs to be replaced and it is not necessaryto replace the second table 41.

Cushion members 51 are arranged in the respective recessed sections 43to make the top surface of the lower mold 42 flat. A material that canabsorb pressure such as rubber is employed for the cushion members.Because cushion members 51 are arranged, when the lower layer material13 a arranged on the lower mold 42 is pressed by the upper mold 21, thepressure is absorbed by the cushion members in the areas where the lowerlayer material 13 a contacts with the cushion members 51. Therefore, theadhesive force of the lower layer material 13 a is not degraded in theareas where the lower layer material 13 a contacts with the cushionmembers 51.

If the cushion members are arranged at the positions where edge (s) ofthe first machining means 22 contacts them, the first machining means 22can no longer cut the lower layer material 13 a, because the pressureapplied by the first machining means 22 is absorbed by the cushionmembers. Therefore, the positions of the cushion members and thepositions the recessed sections 43 are important.

Each of the recessed sections 43 is arranged between a point 443 and apoint 444. The edge of the blade of the first machining means 22contacts with the top surface of the lower mold 42 at points 441, 442.Each of the points 443 and 444 is positioned transversally (in adirection indicated by an arrow U in FIG. 10) and inwardly separatedfrom the points 441, 442 by 0.2 mm to 1 mm. In other words, a distancebetween the point 441 and the point 443 is between 0.2 mm and 1 mm. Ifthe recessed section 43 (the cushion member 51) is arranged in a regionseparated from the positions 441, 442 only by less than 0.2 mm, the edgeof the first machining means 22 may be positioned above the cushionmember 51, in case that the upper mold 21 and the lower mold 42 (secondtable 41) are relatively displaced from each other a little. In such acase, the edge can no longer cut the lower layer material 13 a. If,contrary, the recessed section 43 (the cushion member 51) is arranged ina region separated from the positions 441, 442 by more than 1 mm, thearea to which the lower layer material 13 a applies pressure becomeslarge, to consequently degrade the tacky bonding properties of the lowerlayer material 13 a.

A depth of the recessed sections 43 is preferably between 1 mm and 5 mm.While FIG. 10 shows the depth of the recessed sections 43 is 2 mm, thedepth is not limited to 2 mm. When the depth of the recessed sections 43(and hence the thickness of the cushion members 51) is less than 1 mm,the cushion member 51 cannot sufficiently absorb the pressure applied tothem. When, on the other hand, the depth is more than 5 mm, the cushionmember 51 is depressed to produce a gap between the cusion member 51 andthe lower layer material 13 a. Then, the bottom surface of the lowerlayer material 13 a may not be fiat.

In other words, the pressure applied by the upper mold 21 is absorbed,and the tacky bonding properties of the lower layer material 13 a isprevented from being degraded, by arranging the cushion member 51 inregions other than a portion where the lower layer material 13 a is cut.

The lower mold 42 (or the second table 41) is provided with an aligninghole 45. The pin (not shown) is arranged into the aligning hole 45 ofthe second table 41 and the corresponding aligning holes 24 of the uppermold 21, to align the upper mold 21 and the lower mold 42 (second table41).

<Method for Producing the Decoration Piece>

According to the present invention, the three-dimensional decorationpiece is produced by means of an apparatus as described above in amanner as described below.

In the illustrated example, the intermediate layer material 12 a is puton the first table 31, and the surface layer material 11 a is put on theintermediate layer material 12 a, as shown in FIG. 2. In this stage, thelower layer material 13 a is not put.

While the surface layer material 11 a is put on the intermediate layermaterial 12 a in the illustrated example, the surface layer material 11a may be laid on the intermediate layer material 12 a in advance tointegrally combine the two materials to produce a layered set ofmaterials, which is then on the first table 31. The intermediate layermaterial 12 a may be omitted, if the surface layer material 11 a has athickness sufficient for filling the cavity of the upper mold 21.

Then, as shown in FIG. 3, the upper mold 21 is lowered to press thesurface layer material 11 a and the intermediate layer material 12 a,and a high frequency wave is transmitted by using the upper mold 21 andthe first table 31 respective as anode and cathode. The surface layermaterial 11 a and the intermediate layer material 12 a are heated andmolten. The surface layer material 11 a and the intermediate layermaterial 12 a are molten as a result of being heated, and then flow intothe cavity of the upper m,old 21 so as to take the designed shape. Thesurface layer material 11 a and the intermediate layer material 12 a arefusion-bonded to make a three-dimensionally formed body 14 b.

The three-dimensionally formed body 14 b (the surface layer material 11a and the intermediate layer material 12 a) is fusion-cut by the firstmachining means 22. The formed three-dimensionally formed body 14 b hasthe designed shape by the upper mold 21. Since the top surface of thefirst table 31 is flat as described above, a bottom surface of thethree-dimensionally formed body 14 b is flat. Therefore, thethree-dimensionally formed body produced by the method of the presentinvention has a large area that can be used for adhesion or tackilybonding, to consequently provide a sufficient adhesion or tackilybonding strength.

Additionally, the three-dimensionally formed body 14 b is temporarilyheld to the upper mold 21 by the temporary holding means 25. If thetemporary holding means 25 is a tacky bond tape, the three-dimensionallyformed body 14 b is temporarily held to the upper mold 21 by thepressure applied by the upper mold 21 and the tackily bonding force ofthe temporary holding mean 25.

When the three-dimensionally formed body 14 is made to take the designedshape and temporarily held to the upper mold 21, the high frequencydielectric heating is stopped.

The lower layer material 13 a is put on the second table 41. In theillustrated example, the lower mold 42 is placed on the second table 41.In the illustrated example, the lower layer material 13 a having a sheetof release paper 16 fitted to the rear surface thereof is put on thelower mold 42 (FIG. 8).

Then, the first table 31 arranged below the upper mold 21 is moved away,and the second table 41 is moved to below the upper mold 21. It isconvenient that the first table 31 and the second table 41 are slidable,and can be moved to and away from below the upper mold 21.

In the illustrated example, firstly the upper mold 21 is pulled up withthe three-dimensionally formed body 14 b (FIG. 5), and the first tableis moved away. Subsequently, the second table 41 and the lower mold 42is moved to below the upper mold 21 (FIG. 8). Note that thethree-dimensionally formed body 14 b is temporarily held to the uppermold 21 by the temporary holding means 25.

As shown in FIG. 9, the upper mold 21 is lowered to press thethree-dimensionally formed body 14 b and the lower layer material 13 a.In this case, high frequency wave is not emitted.

Since pins (not shown) are driven into the respective aligning holes 24of the upper mold 21 and the aligning holes 45 of the lower mold 42 atthis time, the upper mold 21 and the lower mold 42 are aligned. Afterthe upper mold 21 and the lower mold 42 are anchored, the pins arepulled away.

As a result of the pressing, the three-dimensionally formed body 14 band the lower layer material 13 a are tackily bonded to each other andintegrally combined due to the tacky adhesive force of the lower layermaterial 13 a.

Due to the pressing, the lower layer material 13 a is cut by the firstmachining means 22 of the upper mold 21. In the illustrated example, nocushion members 51 are found at the positions where the edges of theblades of the first machining means 22 contact the lower layer material13 a, so that the lower layer material 13 a can be cut with ease. On theother hand, the applied pressure is absorbed by the cushion members 51in the regions where the cushion members 51 are placed. Therefore, thetacky adhesive force of the lower layer material 13 a is not degraded inthe regions where the cushion members 51 are placed. While the tackyadhesive force of the lower layer material 13 a is degraded as pressureis applied thereto, such degradation can be prevented according to thepresent invention.

Thus, preferably cushion members 51 are arranged in the regions locatedoutside the areas where the lower layer material 13 a is cut. Thecushion members 51 absorb the pressure applied by the upper mold 21, toprevent the tacky adhesive force of the lower layer 13 from beingdegraded further.

The releasing paper 16 is not cut by the first machining means 22, butstretched to a slight extent.

Thereafter, the upper mold 21 is pulled up (FIG. 11)

The three-dimensionally formed body 14 b and the lower layer material 13a that are now integrally combined is moved away from the upper mold 21,and unnecessary parts thereof are removed.

Subsequently, the application film 15 is attached to the top surface ofthe upper layer 11.

What is claimed is:
 1. A method for producing a three-dimensionaldecoration piece of thermoplastic synthetic resin comprising: putting anupper layer material on a first table operating as cathode; lowering anupper mold operating as anode onto the first table to press the upperlayer material, emitting a high frequency wave for dielectric heating,to form a three-dimensionally formed body from the upper layer materialby molding and fusion-cutting and temporarily holding thethree-dimensionally formed body to the upper mold; stopping the highfrequency dielectric heating; moving a second table carrying a lowerlayer material having a tacky bonding property to below the upper moldtemporarily holding the three-dimensionally formed body; and loweringsaid upper mold onto the second table to press the three-dimensionallyformed body cutting the lower layer material and tacky bonding thethree-dimensionally formed body and the lower layer material, so thatthe lower layer material is not subjected to any high frequencydielectric heating, and is not heated.
 2. The method according to claim1, wherein an intermediate layer material is put on said first tablesaid upper layer material is put on the intermediate layer material; andsaid upper mold is lowered onto the first table to press said upperlayer material and said intermediate layer material and emitting a highfrequency wave for dielectric heating, to form the three-dimensionallyformed body by fusion bonding said upper layer material and saidintermediate layer material.
 3. The method according to claim 1, whereinthe lower layer material having a releasing paper arranged to a rearsurface thereof is put on said second table.
 4. The method according toclaim 1, wherein after the cutting of the lower layer materialunnecessary parts thereof are removed, an application film is adheredonto the top surface of the upper layer.
 5. The method according toclaim 1, wherein a cushion member is arranged under the lower layermaterial in regions located outside areas where the lower layer materialis cut, to absorb the pressure of the upper mold by the cushion member.6. An apparatus configured to produce a three-dimensional decorationpiece of thermoplastic synthetic resin according to the method of claim1, the apparatus comprising: an upper mold operating as anode, a firsttable operating as cathode, and a second table, said upper mold having afirst machining means; the first machining means fusion-cutting amaterial at the time of high frequency dielectric heating between theupper mold and the first table; said first machining means cutting thematerial at the time of pressing between the upper mold and the secondtable; said upper mold being provided on a bottom surface thereof with atemporary holding means; said second table having a flat top surface;said second table being provided on the top surface thereof withrecessed sections, each of which being transversally and inwardlyseparated from a position where an edge of the first machining meanscontacts, by 0.2 mm to 1 mm; and a cushion member being arranged in therespective recessed sections.
 7. An apparatus configured to produce athree-dimensional decoration piece of thermoplastic synthetic resinaccording to the method of claim 1, the apparatus comprising: an uppermold operating as anode, a first table operating as cathode, a secondtable, and a lower mold arranged on the second table; said upper moldhaving a first machining means; the first machining means fusion-cuttinga material at the time of high frequency dielectric heating between theupper mold and the first table; the first machining means cutting thematerial at the time of pressing between the upper mold and the secondtable; said upper mold being provided on a bottom surface thereof with atemporary holding means; said lower mold having a flat top surface; saidlower mold being provided on the top surface thereof with recessedsections, each of which being transversally and inwardly separated froma position where an edge of the first machining means contacts, by 0.2mm to m 1 mm; and a cushion member being arranged in the respectiverecessed sections.
 8. The method according to claim 2, wherein the lowerlayer material having a releasing paper arranged to a rear surfacethereof is put on said second table.
 9. The method according to claim 2,wherein after the cutting of the lower layer material unnecessary partsthereof are removed, an application film is adhered onto the top surfaceof the upper layer.
 10. The method according to claim 3, wherein afterthe cutting of the lower layer material unnecessary parts thereof areremoved, an application film is adhered onto the top surface of theupper layer.
 11. The method according to claim 8, wherein after thecutting of the lower layer material unnecessary parts thereof areremoved, an application film is adhered onto the top surface of theupper layer.
 12. The method according to claim 2, wherein a cushionmember is arranged under the lower layer material in regions locatedoutside areas where the lower layer material is cut, to absorb thepressure of the upper mold by the cushion member.
 13. The methodaccording to claim 3, wherein a cushion member is arranged under thelower layer material in regions located outside areas where the lowerlayer material is cut, to absorb the pressure of the upper mold by thecushion member.
 14. The method according to claim 8, wherein a cushionmember is arranged under the lower layer material in regions locatedoutside areas where the lower layer material is cut, to absorb thepressure of the upper mold by the cushion member.